Semiconductor Packaging: Materials Interaction and Reliability (English, Paperback, Andrea Chen, Randy Hsiao Lo)
by Andrea Chen, Randy Hsiao Lo
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Book Details
About the Book
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the ...
Why You Should Read This Book
- Written by acclaimed authors Andrea Chen, Randy Hsiao Lo
- Published by CRC Press (2016)
- Available in English language
- Ideal for students, professionals, and avid readers
Product Details
This edition of Semiconductor Packaging: Materials Interaction and Reliability is published by CRC Press and was first released in 2016. It is available in multiple formats including Paperback and Hardcover editions, making it convenient for all types of readers.
Who Is This Book For?
Whether you are a student, a professional looking to expand your knowledge, or simply someone who loves reading, Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen, Randy Hsiao Lo is an excellent choice. Order your copy today from GlowMirror and enjoy free shipping with Cash on Delivery option available across India.
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